Curable resin composition, composite member, and production method therefor
US12012532B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 7, 2019 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Jan 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C8-18 alkylene chain and has a melting point from 160 to 250° C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.