Curable resin composition, use thereof, and production method thereof
US12012534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Sep 16, 2041 |
Classification
- Technology area (CPC —)General
Abstract
[Object]The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal.[Solution]A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.