Solid-state passive evaporative cooling system and method
US12013156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2023 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Jul 17, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0029
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A solid-state passive evaporative cooling system includes a hydrogel body, a water supply channel, a hydrogel root, and a water supply device. One end of the water supply channel is embedded into the hydrogel body, and a plurality of water outlets are formed in an outer wall of the water supply channel embedded into the hydrogel body. A water inlet at the other end of the water supply channel is connected to the water supply device which is configured to pump an aqueous solution into the water supply channel. The hydrogel root is disposed within the water supply channel. The aqueous solution is solidified by the hydrogel body to achieve the water-saving effect. During evaporative cooling, an osmotic pressure may be spontaneously created or enhanced within the system. The water supply channel is capable of adjusting the water content of the hydrogel body and providing a water supply driving force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.