Optical transceiver with separated heat dissipation components
US12013583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2022 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Jun 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical transceiver includes a housing, an optical communication module and a heat dissipation module. The optical communication module includes a substrate, a first optical communication component and a second optical communication component located at opposite sides of the substrate, respectively. The heat dissipation module includes a first heat conductive component and a second heat conductive component disposed on the substrate. The first heat conductive component is spatially spaced apart from the second heat conductive component. The first optical communication component is supported on and in thermal contact with the first heat conductive component. The second optical communication component is mounted on the substrate, and the second optical communication component is in thermal contact with the second heat conductive component through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.