Memory system
US12014794B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 24, 2022 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Jan 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a memory system includes a first plate, an intermediate member, and a substrate. The intermediate member includes a second plate and a pair of side walls. The second plate includes a first opening, and is arranged to have a gap with respect to the first plate. The second plate includes a first face facing the first plate and a second face located on a side opposite to the first face. The pair of side walls is arranged on the second face. The substrate is placed between the pair of side walls. The substrate includes a third face on which a first non-volatile memory package and a controller package are mounted. The third face faces the second plate. The first non-volatile memory package is thermally connected to the second plate. The controller package is thermally connected to the first plate through the first opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.