Sensor element and method for producing a sensor element
US12014852B2 · kind B2 · utility
0Cited by
13References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 15, 2020 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Sep 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/474
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.