Hearing device assembly
US12015892B2 · kind B2 · utility
0Cited by
14References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2023 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Feb 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2225/57
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a hearing device assembly comprising a behind-the-ear base unit and an in-the-ear transducer module, which communicate via a communication interface and wherein the base unit is configured to detect whether the transducer module comprises a microcontroller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.