Interconnectable circuit boards adapted for three-dimensional constructions as lighting sources
US12016121B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2021 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Oct 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.