Method of manufacturing printed circuit board
US12016130B2 · kind B2 · utility
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13Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 1, 2022 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Mar 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.