Heat sink with improved thermal conductivity
US12016155B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jul 11, 2019 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Sep 28, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2215/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink including a first face in contact with electronic components generating heat to be removed and a second face in contact with the medium into which to dissipate the heat generated by the electronic components, including: at least one device for enhancing the thermal conductivity including a dome-shaped surface, a pin and a lateral section of revolution about the pin, the dome-shaped surface being connected to one end of a pin and to the lateral section of revolution, the dome-shaped surface being arranged on the second-face side, the free end of the pin being arranged on the first-face side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.