Cutting processing apparatus
US12017316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2018 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Nov 4, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23Q2717/006
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting processing apparatus includes a cutting tool, a chuck portion, a feed mechanism, a fixing portion that fixes the cutting object, a stage that moves the fixing portion at a processing speed in a direction substantially orthogonal to a rotation axis of the chuck portion, a sensor that is arranged in the vicinity of a position on the fixing portion at which the cutting object is fixed, detects vibration of the cutting tool during cutting processing of the cutting object, and outputs a monitoring signal, and a control circuit that converts time waveform data of the monitoring signal to frequency waveform data and extracts an impact amount during cutting processing of the cutting object from the frequency waveform data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.