Overmoulded printed electronic parts and methods for the manufacture thereof
US12017392B2 · kind B2 · utility
0Cited by
2References
23Claims
0Family size
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Key dates
| Filing date | Aug 7, 2019 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Oct 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.