Patent · US Active

Metallic substrate treatment methods and articles comprising a phosphonate functionalized layer

US12018380B2 · kind B2 · utility

0Cited by
5References
14Claims
0Family size

Assignee

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Key dates

Filing dateDec 18, 2019
Grant dateJun 25, 2024
Priority date
Expiry dateOct 1, 2040

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB60B1/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Metallic substrate treatment methods and articles comprising a phosphonate functionalized layer are provided. The method comprises contacting a metallic substrate comprising at least one of aluminum and an aluminum alloy with a fluid to form a phosphonate functionalized layer on at least a region of the metallic substrate. The fluid comprises at least one of a phosphonate containing acid and a derivative thereof. At least one of the phosphonate containing acid and the derivative thereof comprises a pKa of a first acidic proton. The fluid comprises a pH at least 0.5 pH value greater than the pKa of the first acidic proton. The article comprises a metallic substrate comprising aluminum or an aluminum alloy and a phosphonate functionalized layer on at least a region of the metallic substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.