Patent · US Active

Systems and methods for thermal management using separable heat pipes and methods of manufacture thereof

US12018892B2 · kind B2 · utility

0Cited by
20References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 2, 2021
Grant dateJun 25, 2024
Priority date
Expiry dateAug 5, 2042

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF28F2275/10
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

Systems and methods for thermal management using separable heat pipes and methods of manufacture thereof. Various embodiments provide a porous insert that can be used to join or connect heat pipes. Further embodiments provide thermal management systems that are modular, expandable, reparable, by allowing for joining of evaporators, condensers, and adiabatic sections via porous inserts. Various embodiments allow for two-phase thermal management systems, where liquid and gaseous phases can be transported simultaneously. Certain embodiments incorporate heat generating components with embedded evaporators and/or condensers. Many embodiments are additively manufactured, including via 3D printing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.