Photosensitive resin composition, film, and electronic device
US12019373B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 24, 2019 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Aug 31, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.