Non-volatile memory package and storage device comprising the same
US12020765B2 · kind B2 · utility
0Cited by
4References
20Claims
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Key dates
| Filing date | Aug 23, 2021 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Jun 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B43/40
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Provided is a non-volatile memory package that is electrically optimized with a plurality of different non-volatile memory chips through a ball map, by fixing positions of buffer chips connected to the plurality of different non-volatile memory chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.