Apparatus for electro-chemical plating
US12020922B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2021 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Feb 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical plating apparatus for performing an edge bevel removal process on a wafer includes a cell chamber. The cell chamber includes two or more nozzles located adjacent to the edge of the wafer. A flow regulator is arranged with each of the two or more nozzles, which is configured to regulate an tap width of a deposited film flowing out through the each of the two or more nozzles. The electrochemical plating apparatus further includes a controller to control the flow regulator such that tap width of the deposited film includes a pre-determined surface profile. The two or more nozzles are located in radially or angularly different dispensing positions above the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.