Transfer tool and method for transferring semiconductor chips
US12020973B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 24, 2019 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Jul 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment a transfer tool includes an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip and a device configured to adjust a surface area of the adhesive surface, wherein the adhesive stamp is deformable, wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp, wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and wherein the adhesive surface is free of interruptions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.