Circular wafer lateral positioning device
US12020974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2020 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Oct 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer positioning device includes at least one fixed stop that is positioned at a periphery of a clamped position on a surface of a chuck and an extendible finger. A finger extension mechanism extends the finger outward toward a center of the chuck surface, and retracts the finger away from the center of the chuck surface. The finger is configured, when a wafer is placed on the chuck surface and the finger extension mechanism is operated to extend the finger outward, to push the wafer laterally toward the fixed stop until an edge of the wafer contacts the fixed stop when a distal end of the finger is at the periphery of the clamped position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.