Method for manufacturing package structure
US12021037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2022 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Dec 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Package structures and methods for forming the same are provided. The method includes forming a passivation layer having an opening and forming a first seed layer in the opening. The method further includes filling the opening with a conductive layer over the first seed layer and bonding an integrated circuit die to the conductive layer over a first side of the passivation layer. The method further includes removing a portion of the first seed layer to expose a top surface of the conductive layer and to partially expose a first sidewall of the passivation layer from a second side of the passivation layer and forming a second seed layer over the top surface of the conductive layer and over the first sidewall of the passivation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.