Patent · US Active

Photonic chip with buried laser source

US12021347B2 · kind B2 · utility

0Cited by

1References

10Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Sylvie Menezo · Voiron, FR
Severine Cheramy · Grenoble, FR

Key dates

Filing date	May 14, 2019
Grant date	Jun 25, 2024
Priority date	—
Expiry date	Jul 6, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH10H29/10
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A photonic chip includes an optical layer bonded, via a bonding interface, to a carrier, and a laser source having a waveguide encapsulated in an encapsulating sublayer of the optical layer, the waveguide having a first electrical contact embedded in the encapsulating sublayer. The photonic chip also includes an interconnect metal network forming a via that extends, in the optical layer, from the bonding interface to the first embedded electrical contact of the waveguide, the interconnect metal network having metal vias that electrically connect to one another metals lines that extend mainly parallel to the plane of the chip, the metal lines being arranged one above the other within the optical layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.