Radio frequency front-end module, manufacturing method thereof and communication device
US12022616B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2023 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | May 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10984
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radio frequency front-end module, a manufacturing method thereof and a communication device are provided. The radio frequency front-end module includes a first base substrate and a metal bonding structure; a second functional substrate, including a second base substrate, a groove in the second base substrate, and a bonding metal layer; and a first radio frequency front-end component, at least partially located in the groove, the first base substrate and the second base substrate are oppositely arranged, and a surface of the second base substrate close to the first base substrate includes a groove surface inside the groove and a substrate surface outside the groove, and the bonding metal layer includes a first metal portion located on the groove surface and a second metal portion located on the substrate surface, the first radio frequency front-end component is at least partially surrounded by the first metal portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.