Printed circuit board and method for manufacturing the same
US12022621B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Jul 20, 2022 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Feb 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.