Cutting method using diamond cutting tool
US12023741B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Mar 9, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | May 4, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23B2226/31
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a cutting method of cutting, with a diamond cutting tool, a metal material having at least a solid solution layer on a surface, the solid solution layer containing nitrogen atoms as interstitial solid solution atoms. In this method, cutting is performed in a region where a nitrogen concentration is equal to or greater than a predetermined concentration, and cutting is not performed in a region where the nitrogen concentration is less than the predetermined concentration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.