SiC-bound hard material particles, porous component formed with SiC-bound diamond particles, method of producing same and use thereof
US12024666B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Mar 14, 2019 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Jun 11, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/5436
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to SiC-bound diamond hard material particles, a porous component formed with SiC-bound diamond particles, methods for producing same and the use thereof. Diamond hard material particles and components have a composition of 30 vol. % to 65 vol. % diamond, 70 vol % to 35 vol. % SiC and 0 to 30 vol. % Si, and a component has a porosity in the range of 10% to 40%
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.