Dielectric film, method for producing same and optical member using same
US12024767B2 · kind B2 · utility
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1References
9Claims
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Key dates
| Filing date | Oct 31, 2019 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | May 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2207/107
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A dielectric film is provided on a transparent substrate. The dielectric film has at least one low refractive index layer. An uppermost layer of the dielectric film contains SiO2 and has a film density of 92% or more. The uppermost layer contains an element having an electronegativity smaller than Si.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.