Socket interposer for system-in-package (SIP) module qualification in product platform validation (PPV) setup
US12025971B2 · kind B2 · utility
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2References
19Claims
0Family size
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Key dates
| Filing date | Feb 9, 2022 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Apr 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.