Light-emitting diode chip, display substrate and manufacturing method thereof
US12027648B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 29, 2020 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Mar 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.