Patent · US Active

Optoelectronic semiconductor component and method for producing optoelectronic semiconductor components

US12027656B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Michael Zitzlsperger · Regensburg, DE
Matthias Goldbach · Dresden, DE
Benjamin HÖFLINGER · Regensburg, DE

Key dates

Filing date	Feb 17, 2020
Grant date	Jul 2, 2024
Priority date	—
Expiry date	Mar 14, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/855
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.