Device with multi-channel bonding
US12028168B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2022 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Sep 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L47/41
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A system may include primary and secondary integrated circuits. The primary integrated circuit may receive a first subset of data packets associated with a first set of sequence numbers. The secondary integrated circuit may receive a second subset of data packets associated with a second set of sequence numbers. The primary integrated circuit is configured to manage the first set of sequence numbers and the second set of sequence numbers on behalf of the secondary integrated circuit and for the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.