Passivation of grain boundaries of perovskite films with biphenyl moieties
US12029110B1 · kind B1 · utility
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16Claims
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Key dates
| Filing date | May 3, 2023 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | May 3, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A passivated perovskite film is provided, the passivated perovskite film comprising: a perovskite film, which includes an upper surface and at least one grain boundary; and a biphenyl methyl ammonium halide coating on the upper surface of the perovskite film, wherein the halide is selected from the group consisting of chloride, bromide and iodide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.