Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards
US12030138B2 · kind B2 · utility
0Cited by
9References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 11, 2020 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Apr 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0435
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter D0 made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.