Methods and apparatuses for cutting
US12030215B2 · kind B2 · utility
0Cited by
21References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Jun 14, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D7/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Cutting apparatuses and methods of use thereof are discussed. For example, the cutting apparatus may include a chassis with one or more substrate interfaces and a scribe guide. The cutting apparatuses also may include a plurality of support pistons, a deformable support, a locking mechanism, and/or an anchor extension. The support pistons may be adjustable to generally conform to a substrate, such as a non-planar substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.