High dynamic temperature control system

US12030224B2 · kind B2 · utility

Assignee

• WATLOW ELECTRIC MANUFACTURING COMPANY · US

Inventors

• Martin Wallinger · Bischofshofen, AT
• Gerhard Schefbanker · Bischofshofen, AT
• Wolfgang Pöschl · Abtenau, AT
• Gernot Antosch · Altstadt, AT
• Reinhardt Lehnert · Ubstadt-Weiher, DE
• Michael Kübler · Oberheinriet, DE
• August Burr · Schwäbisch Gmünd, DE

Key dates

• Filing date: Feb 28, 2022
• Grant date: Jul 9, 2024
• Expiry date: Feb 28, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05B2203/003
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.