Resin-sealed electronic component and method for manufacturing the same
US12030230B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Nov 24, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin-sealed electronic component includes an electronic component main body sealed with a resin housing. The resin housing includes a pair of resin members aligned in a first direction with sandwiching a housing space housing the electronic component main body, and a sealing member including a molding resin and being molded so as to cover at least a portion of each of the pair of resin members. A portion of one resin member of the pair of resin members and a portion of the other resin member are aligned in a second direction intersecting the first direction to constitute a suppression structure that suppresses the molding resin from entering the housing space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.