Patent · US Active

Adhesive compositions, assemblies, and methods thereof

US12031063B2 · kind B2 · utility

0Cited by
9References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 25, 2019
Grant dateJul 9, 2024
Priority date
Expiry dateJun 15, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J171/02
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Described are adhesive compositions containing a block copolymer component that includes a midblock segment and a plurality of end block segments, each end block segment comprising polystyrene, a (meth)acrylic functional additive having a glass transition temperature of from 50° C. to 160° C., a first tackifier compatible with the midblock segment and containing a hydrocarbon, and a second tackifier compatible with the end block segments and containing a polyphenylene ether. These compositions are useful in providing pressure-sensitive adhesives that are melt processible, display a high temperature resistance, and effectively bond to low surface energy substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.