Patent · US Active

Test socket assemblies with liquid cooled frame for semiconductor integrated circuits

US12032000B2 · kind B2 · utility

1Cited by

8References

17Claims

0Family size

Assignee

Smiths Interconnect Americas, Inc. · US

Inventors

Quynh Ngoc Nguyen · Fremont, US
James E. Spooner · Sunderland, GB

Key dates

Filing date	Aug 12, 2022
Grant date	Jul 9, 2024
Priority date	—
Expiry date	Jan 4, 2043

Classification

Technology area (CPC G)Physics
CPC primaryG01R3/00
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.