Chip-scale silicon-based hybrid-integrated LiDAR system
US12032094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | May 13, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/292
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A chip-scale silicon-based hybrid-integrated LiDAR system, wherein a transmitting end thereof sequentially comprises a narrow-linewidth tunable laser source, a silicon-nitride-based beam splitter, a silicon-based phase shifter array and a silicon-nitride-based unidirectional transmitting antenna array w.r.t the optical path. Based on the principle of reciprocity of light propagation, the receiving end thereof sequentially comprises a silicon nitride unidirectional receiving antenna array, a silicon nitride beam splitter and a silicon-based coherent receiving module. It also comprises a backup system and an electric controller as the driver of the phase shifters and the processing module. Modules on the silicon platform and the silicon nitride platform are monolithic integrated in a multilayer sandwiched fashion by means of a tapered silicon/silicon nitride evanescent inter-layer coupler; and a gain chip in the tunable laser module and a silicon nitride waveguide are hybrid-integrated by horizontal coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.