Thermal hinge system
US12032171B1 · kind B1 · utility
1Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2022 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | May 16, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.