Patent · US Active

Optimizing place-and-routing using a random normalized polish expression

US12032893B2 · kind B2 · utility

0Cited by
11References
20Claims
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Key dates

Filing dateDec 14, 2021
Grant dateJul 9, 2024
Priority date
Expiry dateDec 14, 2041

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG09G3/2088
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

Simultaneous automatic placement and routing speeds up implementation an integrated circuit layout and improves the resulting layout such that the layout is more compact, has reduced parasitics, and has improved circuit performance characteristics (e.g., power, frequency, propagation delay, gain, and stability). A technique generates solutions based on random normalized polish expression, and includes cost considerations based on routing of interconnect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.