Modular quantum processor architectures

US12033032B2 · kind B2 · utility

Assignee

• Rigetti & Co, LLC · US

Inventors

• Michael Justin Gerchick Scheer · Oakland, US
• Maxwell Benjamin Block · Oakland, US
• Benjamin Jacob Bloom · Berkeley, US
• Matthew J. Reagor · Corte Madera, US
• Alexander Papageorge · San Francisco, US
• Kamal Yadav · Fremont, US
• Nasser Alidoust · Berkeley, US
• Colm Andrew Ryan · Cambridge, US
• Shane Arthur Caldwell · Oakland, US
• Yuvraj Mohan · Fremont, US
• Anthony Polloreno · Carlsbad, US
• John Morrison Macaulay · Emeryville, US
• Blake Robert Johnson · El Cerrito, US

Key dates

• Filing date: Dec 11, 2020
• Grant date: Jul 9, 2024
• Expiry date: Sep 27, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N60/12
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

In a general aspect, a quantum processor has a modular architecture. In some aspects, a modular quantum processor includes first and second quantum processor chips and a cap structure. The first quantum processor chip is supported on a substrate layer and includes a first plurality of qubit devices. The second quantum processor chip is supported on the substrate layer and includes a second plurality of qubit devices. The cap structure is supported on the first and second quantum processor chips and includes a coupler device that provides coupling between at least one of the first plurality of qubit devices with at least one of the second plurality of qubit devices. In some instances, the coupler device is an active coupler device that is configured to selectively couple at least one of the first plurality of qubit devices with at least one of the second plurality of qubit devices.