Cable bonding protection for head dimensional stability
US12033678B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Dec 23, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2220/90
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a beam, a chip coupled to the beam, a cable coupled to the beam by a first material located at opposite edges of the cable, and wire bonds extending from pads of the cable to pads of the chip. An apparatus includes a beam and a chip coupled to the beam. The chip includes an array of magnetic transducers for transducing data on a magnetic recording tape. The apparatus includes a cable coupled to the beam by a first material located at opposite edges of the cable, wire bonds extending from pads of the cable to pads of the chip, and a second material encapsulating ends of the wire bonds that are located adjacent the cable. The second material does not contact the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.