Electronic apparatus and manufacturing method thereof
US12034002B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2022 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Apr 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.