Chip packaging structure
US12034201B2 · kind B2 · utility
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0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2022 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Aug 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/36
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip packaging structure includes a chip module and a main body, wherein the main body has a first portion, a second portion, and a holding portion. The second portion protrudes from the first portion, and a size of the second portion is less than a size of the first portion. The holding portion is located at the second portion, and the chip module is placed at the holding portion to be engaged with the main body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.