Enhanced electronic sensors
US12034422B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Aug 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/0457
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A micro-structured device that can improve sensitivity and signal-to-noise for electronic sensor materials is embedded in electrically resistive materials. The technology includes a three-dimensional embedded electrode structure and fabrication methods for making the device for electronic sensing in bulk resistive materials. Embedded electrode structures address issues in conventional sensors by allowing independent control of sensitive material thickness, area, electric field intensity, and field direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.