Electroconductive substrate having metal wiring, method for producing the electroconductive substrate, and metal ink for forming metal wiring
US12035470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2019 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | May 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0379
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt % or more. The antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The electroconductive substrate is formed from metal wiring from a metal ink that forms roughened particles, followed by application of a blackening ink containing blackened particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.