Leached diamond elements and leaching systems, methods and assemblies for processing diamond elements
US12037291B2 · kind B2 · utility
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177References
20Claims
0Family size
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Key dates
| Filing date | Mar 27, 2023 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Mar 27, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C2352/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Method of processing a polycrystalline diamond element may include laser ablating at least a portion of a polycrystalline diamond element to form a laser-shaped surface and exposing at least a portion of the laser-shaped surface to a leaching solution to define a leached polycrystalline diamond volume and an unleached polycrystalline diamond volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.