Resin composition and article made therefrom
US12037490B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Nov 15, 2021 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Jul 11, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2471/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.