Copper alloys with high strength and high conductivity, and processes for making such copper alloys
US12037671B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Apr 9, 2020 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Jun 27, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C9/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper alloy that is devoid of beryllium and has a 0.2% offset yield strength of at least 70 ksi and an electrical conductivity of at least 75% IACS is disclosed. The copper alloy comprises chromium, silicon, silver, titanium, zirconium, and balance copper. The alloy is prepared by cold working, solution annealing, and aging. The alloy can be used in several different applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.