Stress-testing electrical components using telemetry modeling
US12038479B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 9, 2022 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Sep 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q9/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method, computer system, and computer program product are provided for stress-testing electronics using telemetry modeling. Telemetry data is received from one or more devices under test during a hardware testing phase, the telemetry data including one or more telemetry parameters. The telemetry data is processed using a predictive model to determine future values for the one or more telemetry parameters. Additional hardware testing is performed, wherein the additional hardware testing includes adjusting one or more testing components based on the determined future values.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.